058-005315-001 Part Manufactured by Pyramid Semiconductor Corp - Request a Quote Now
Inclosure Configuration: Leadless flat pack Operating Temp Range: -55.0 to 125.0 deg celsius Features Provided: Hermetically sealed and burn in and monolithic and bidirectional and W/enable
We’re happy to announce that part number 058-005315-001 is now available in our ready-to-ship inventory. Manufactured by Pyramid Semiconductor Corp, this part is described as Inclosure Configuration: Leadless flat pack Operating Temp Range: -55.0 to 125.0 deg celsius Features Provided: Hermetically sealed and burn in and monolithic and bidirectional and W/enable. Would you like a quick quote for this part number? Just fill out the form to get started. Your quote will be calculated on the basis of your answers to asterisk-marked (*) fields such as Needs Parts By and Quantity (ea), so make sure that you fill them out completely. A dedicated sales representative will respond to your RFQ by email or by phone within 15 minutes of receiving this form
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Procurement notes for 058-005315-001.
Inclosure Configuration: Leadless flat pack Operating Temp Range: -55.0 to 125.0 deg celsius Features Provided: Hermetically sealed and burn in and monolithic and bidirectional and W/enable ASAP can support availability checks, alternate review, lead-time confirmation, and documentation requirements tied to the part number, NSN, CAGE code, or active bill of materials.
Catalog classifications
NSN Information for Part Number 058-005315-001 with NSN 5962-01-299-4554, 5962012994554
Characteristics Data of NSN 5962-01-299-4554, 5962012994554
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.392 INCHES MINIMUM AND 0.408 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.292 INCHES MINIMUM AND 0.308 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.062 INCHES MINIMUM AND 0.078 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 1.0 WATTS |
| AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND BIDIRECTIONAL AND W/ENABLE |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 22 INPUT |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.3 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |
| CZEQ | TIME RATING PER CHACTERISTIC | 45.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 45.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| CZER | MEMORY DEVICE TYPE | RAM |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| TTQY | TERMINAL TYPE AND QUANTITY | 24 LEADLESS |